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Investigation of AlInN HEMT structures with different AlGaN buffer layers grown on sapphire substrates by MOCVD

机译:通过MOCVD研究在蓝宝石衬底上生长具有不同AlGaN缓冲层的AlInN HEMT结构

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摘要

We investigate the structural and electrical properties of Al xIn 1-xN/AlN/GaN heterostructures with AlGaN buffers grown by MOCVD, which can be used as an alternative to AlInN HEMT structures with GaN buffer. The effects of the GaN channel thickness and the addition of a content graded AlGaN layer to the structural and electrical characteristics were studied through variable temperature Hall effect measurements, high resolution XRD, and AFM measurements. Enhancement in electron mobility was observed in two of the suggested Al xIn 1 -xN/AlN/GaN/Al 0.04Ga 0.96N heterostructures when compared to the standard Al xIn 1 -xN/AlN/GaN heterostructure. This improvement was attributed to better electron confinement in the channel due to electric field arising from piezoelectric polarization charge at the Al 0.04Ga 0.96N/GaN heterointerface and by the conduction band discontinuity formed at the same interface. If the growth conditions and design parameters of the Al xIn 1-xN HEMT structures with AlGaN buffers can be modified further, the electron spillover from the GaN channel can be significantly limited and even higher electron mobilities, which result in lower two-dimensional sheet resistances, would be possible. © 2012 Elsevier B.V. All rights reserved.
机译:我们研究了通过MOCVD生长的具有AlGaN缓冲层的Al xIn 1-xN / AlN / GaN异质结构的结构和电学性质,可以用作具有GaN缓冲层的AlInN HEMT结构的替代品。通过可变温度霍尔效应测量,高分辨率XRD和AFM测量研究了GaN沟道厚度和在结构和电学特性中添加含量分级的AlGaN层的影响。与标准的Al xIn 1 -xN / AlN / GaN异质结构相比,在两个建议的Al xIn 1 -xN / AlN / GaN / Al 0.04Ga 0.96N异质结构中观察到电子迁移率提高。这种改善归因于由于在Al 0.04Ga 0.96N / GaN异质界面处的压电极化电荷产生的电场以及在同一界面处形成的导带不连续性,从而使电场更好地限制在沟道中。如果可以进一步修改带有AlGaN缓冲层的Al xIn 1-xN HEMT结构的生长条件和设计参数,则可以显着限制电子从GaN通道溢出,甚至更高的电子迁移率,从而降低二维薄层电阻,这是可能的。 ©2012 Elsevier B.V.保留所有权利。

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